summary
WP-B1268 is a low-temperature curing epoxy resin system of WAM, which is compounded by epoxy resin and special curing system, with good resin process operability and high mechanical properties, and is mainly applied to the preparation of large composite structural parts in carbon fiber automobile, wind power, high-speed rail, aerospace and aviation fields.
Features and Benefits
- High bonding strength
- Low-pressure vacuum bag molding
- Good conformability and fit
Prepreg process
- Gluing conditions - Gluing temperature 55-65℃. The temperature can be increased when the amount of glue applied is small. (To obtain better gluing surface)
- Impregnation conditions - Impregnation temperature 65-78°C. In case of insufficient impregnation, it is necessary to raise the temperature appropriately. In case of insufficient impregnation, it is necessary to increase the temperature appropriately (in practice, it is necessary to consider the production speed and the thickness of the product, and select the appropriate conditions) - Note that the resin is easy to be cured under the conditions of 80 ℃ and above.
Reference curing conditions
Recommended curing conditions for molding at atmospheric pressure
- 80°C3h;
- 90°C2h
- 100℃*1h
Actual curing time is related to pressure, fiber/resin shape, thickness and heat transfer rate.