Product Properties
Byronic H 892-02 is a low shrinkage additive for Grade A surface SMC / BMC. It has very low resin viscosity and excellent system shrinkage control.
major application
Byronic H 892-02 is ideal for products with A-grade surfaces or high surface brightness. Shrinkage can be controlled to zero or negative, making it suitable for a wide range of products that require shrinkage or surface quality. At the same time, Byorozai H 892-02
It has very good heat resistance, water resistance and weather resistance, and can meet the requirements of some special products.
Automotive parts: various automotive exterior parts
Electronic and electrical appliances: motor molded parts, precision injection parts Others: products with requirements for shrinkage and brightness
Product Specification
performances | realm | unit (of measure) | Test Standards |
---|---|---|---|
exterior condition | Clear/muddy | - | TM 2265 |
Viscosity 23℃ | 140-165 | mPa.s | TM 2013 |
acid value | 4-7 | mgKOH/g | TM 2401 |
inherent | 39.5-41.5 | % | TM 2033 |
Liquid resin properties (typical values)
performances | numerical value | unit (of measure) | Test Standards |
---|---|---|---|
Storage period (unprimed, dark) | 3 | moon | 20°C |
Suggested Initial SMC Paste Formulation
ingredient | Weight (kg) |
---|---|
P 18-03 | 50 |
H 892-02 TBPB | 50 |
Zinc stearate | 1.5 |
CaCO3 | 4.5 |
MgO paste (35% MgO content) | 180 |
MgO | 2.5 |
H 892-02 System SMC Molding Compound Typical Properties
performances | numerical value | unit (of measure) | Test Standards |
---|---|---|---|
intensity | -30 | g/cm3 | - |
Glass fiber content | -0.06 | % | - |
shrinkage | 175 | % | DIN 53464 |
bending strength | 10000 | MPa | ISO 178 |
Bending modulus of elasticity | 80 | MPa | ISO 178 |
tensile strength | 9000 | MPa | ISO 527-2 |
tensile modulus | 3.1 | MPa | ISO 527-2 |
Elongation at break | - | % | ISO 527-2 |
Instructions for use and precautions
H 892-02 is usually used in combination with P 18-03 for the production of low shrinkage molding compounds. Generally, the ratio of P 18-03 to H 892-02 is 50:50, but it can be adjusted according to the actual situation. Molding conditions are: 140~160°C and 50~100kg/cm2. Depending on the dimensional requirements of the final product, 300ppm~ 600ppm p-benzoquinone can be added to the formula (calculated on the basis of the total amount of resin and low shrinkage additives).