High toughness vinyl resin adhesive
Neobond? VE 6100-W-1 has excellent corrosion and water resistance and low exotherm during cure.
Characteristic performance
- Good thermal stability, toughness
- Excellent corrosion and water resistance
- low exothermic
Product Properties
Neobond? VE 6100-W-1 is based on a high tenacity vinyl adhesive.
agent, already contains accelerator. It is capable of meeting high output machine dosing.
typical application
Neobond? VE 6100-W-1 is suitable for bonding FRP articles under high dynamic loads in a wide temperature range. Due to its good toughness and low exothermic properties during curing, it is possible to apply thicker coatings without cracking.
Neobond? VE 6100-W-1 shows good thermal stability and toughness under dynamic loading, excellent corrosion and hydrolysis resistance. To prevent large shrinkage, it is equipped with a low exothermic system. To facilitate machine dosing, a curing indicator is added to the system. Very high thixotropy ensures no sagging in vertical surfaces in thicknesses of 1-20 mm.
Neobond? VE 6100-W-1 cures without crusting on the surface. Air bubbles do not occur with ordinary MEKP curing agents.
Product Indicators
| performances | numerical value | unit (of measure) | Test Methods |
|---|---|---|---|
| exterior condition | light brown | - | - |
| Viscosity @23°C Maximum color change | 1200-2000 | mPa-s | TM 2265 |
| Gel time (23°C, 200g 2% M50) | 2 | - | TM 2013 |
| Gel time (25°C to 35°C) | 55-65 | mPa-s minutes | TM 2326-1 |
| Curing time (25°C to exothermic peak) | 38-41 | minutes | TM 2326-2 |
| peak exothermic temperature (physics) | 51-61 | ℃ | TM 2625 |
| Refractive index 20℃ | 1.5535-1.5570 | - | TM 2150 |
1) Viscosity: Unpremixed Max, Brookfield RVT, #TF, rpm
2) Reactivity at 25 °C: 3 g of Butanox? M50 (Nouryon) in 100 g of base resin.
3) Test base resin
Typical Properties of Liquid Resins
| performances | numerical value | unit (of measure) | Test Methods |
|---|---|---|---|
| Density, 23°C | Approx. 1240 | kg/m3 | TM 2160 |
| flash point | 33 | °C | TM 2800 |
| Storage period, no initiator added, protected from light, 25 °C | June | - | - |
Typical properties of adhesive curing
| performances | numerical value | unit (of measure) | Test Methods |
|---|---|---|---|
| tensile strength | >50 | MPa | ISO 527-2 |
| tensile modulus | >3.4 | GPa | ISO 527-2 |
| Elongation at break | >2.5 | % | ISO 527-2 |
| heat distortion temperature | 70 | °C | ISO 75-2 |
| impact strength | n.a. | kJ/m2 | ISO 179 |
| Wire shrinkage | <0.35 | % | ISO 3521 |
| Coefficient of thermal expansion (-40°C - +60°C) | <65*10^-6 | ℃^-1 | DIN 53752 |
| Water absorption (7 days) | 30 | mg | ISO 62 |
| durometer | 10 | Barcol | EN 59 |
Curing conditions: add 2% Butanox? M50 (Nouryon) to cure; cure 24 hours at room temperature, 24 hours at 50°C
Supplementary performance (typical)
| performances | numerical value | unit (of measure) | Test Methods |
|---|---|---|---|
| Viscosity @23℃ | 460-500 | mPa-s | TM 2011 |
| Shore hardness D (after 4 hours) | >60 | - | specialty |
| Adhesive strength to laminate (after 4 hours) | >40 | Nm | specialty |
| Gel time (25°C to 35°C) | 60-80 | minutes | TM 2625 |
| Curing time (25°C to exothermic peak) | 85-110 | minutes | TM 2625 |
| peak exothermic temperature (physics) | 85-105 | °C | TM 2625 |
| Styrene content | 34-38 | % | TM 2033 |
| acid value | 4-8 | mgKOH/g | TM 2401 |
1) Physica, Z2, 100s-1
2) Reactivity at 25 ℃: Add 2g of Butanox? M50(Nouryon) to 100g of resin.
Process Operation Guide
- The bonding adhesive should be kept at a constant temperature of 20-25 °C before use in mechanical conveyors;
- Before use in manual operation, the bonding adhesive should be thermostated to 15-25°C.
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